mDOC H3

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公司名称:北京元大兴业科技有限公司
  地:北京通州
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产品简介

mDOC H3

产品详细信息

mDOC H3

Personal storage
Based on more than 15 years of flash expertise, a robust intellectual property portfolio and millions of deployed tier-1 mobile handsets, mDOC H3 brings a smarter new approach to embedded flash drives. Now you can access the latest, cost-effective NAND flash technologies with plug-and-play ease.

personal storage. made smarter.

Embedded flash management for speedy integration and upgrades
Our patented flash management software, TrueFFS, is now embedded into mDOC H3 as firmware. This transparently addresses the growing complexities associated with designing raw NAND flash material, and speeds overall software qualification processes.
flash management. made smarter.

Multiple sources for supply continuity
mDOC H3 is the first multi-sourced embedded flash drive, using raw NAND flash material from our partners, including Toshiba and Hynix. Multiple sources help reduce supply chain risks and optimize costs.
sourcing. made smarter.

Standardized architecture for fast access to the latest NAND technologies
Raw NAND flash is one of the most unpredictable materials to work with, changing from one generation to the next. Unfortunately, mobile chipsets cannot effectively support the latest, cost-effective material in time for you to utilize it in your design. This lag in support can unnecessarily inflate your design costs.

mDOC H3 perfects the embedded flash drive architecture by building TrueFFS flash management software into its controller as firmware, rather than running it on the host processor, and by standardizing the hardware interface. This minimizes time-intensive software integration efforts, masking inherent raw NAND flaws and enabling you to transition quickly to newer flash technologies as they become available.
NAND access. made smarter.

mDOC H3 offering

Density

1Gbit (128Mbytes)-16Gbits (2Gbytes)

TrueFFS flash management

Embedded in firmware

NAND flash technology

MLC, SLC

Package

FBGA
9mm x 12mm
11mm x 14mm
12mm x 18mm

XIP boot block

32KB

Deep power-down mode

yes

Protected partitions

10

mDOC H3 based MCP offering

Package:

  • With SDR SDRAM in FBGA package
    • 9mm x 12mm
    • 11mm x 14mm
  • With DDR SDRAM in FBGA package
    • 11mm x 14mm

Density:

  • SDR/DDR SDRAM: 128Mbits, 256Mbits, 512Mbits (16Mbytes, 32Mbytes, 64Mbytes)
  • mDOC H3: 1Gbit, 2Gbits, 4Gbits (128Mbytes, 256Mbytes, 512Mbytes)

Combinations: Available for volume order

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