硅片切削液L200C浓缩切削液 L200C Cutting Fluid Conc. for Silicon Ingot Bricking/Squaring / Cropping 用于硅锭切块/破方/修整的L200C浓缩切削液Application: Diamond wire & Band saw processes 用途：金刚石线锯和带锯流程L200C lubricant Series is a biodegradable water based, non caustic material L200C系列润滑剂是一种可生物降解、水性、非碱性物质Dilution ratio of DI /RO water: Cutting Fluid - 50:1 to 80:1 去离子水/反渗透水溶液比例:切削液 - 50:1至80:1Excellent wetting and rinsing properties 极好的湿润和冲洗功能Increases heat transfer (heat dissipation) hence reduces heat buildup and thermal stress 可以加快传热(散热)速度，减少生热和热应力High speed water surface tension reducer 迅速降低水表面张力Prevents silicon dust (swarf) agglomeration, allowing for easier cutting 防止硅尘(硅屑)堆积，更加容易切削浓缩切削液 蓝宝石切削液 晶体切削液 切削液本产品溶解比例高，在线割过程中带走热量、降低金钢线热量，延长金钢线的使用寿命。